Patent Assignment Details
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| Reel/Frame: | 015463/0899 | |
| Pages: | 3 |
| | Recorded: | 06/10/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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10865474
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Filing Dt:
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06/10/2004
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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Correspondence name and address
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RATNERPRESTIA
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LAWRENCE E. ASHERY
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SUITE 301, ONE WESTLAKES
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BERWYN, P.O. BOX 980
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VALLEY FORGE, PA 19482-0980
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