Patent Assignment Details
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| Reel/Frame: | 015497/0063 | |
| Pages: | 3 |
| | Recorded: | 03/25/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/07/2006
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Application #:
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10490629
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Filing Dt:
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03/25/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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RESIN COMPOSITION WITH HIGH THERMAL CONDUCTIVITY AND MEHOD OF PRODUCING THE SAME
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Assignees
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| 12-32, TAISEI-CHO, NEYAGAWA-SHI |
| OSAKA, JAPAN |
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| 3-20, NAKANOSHIMA 1-CHOME, KITA-KU |
| OSAKA-SHI |
| OSAKA, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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MICHAEL R. DAVIS
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2033 K STREET, N.W.
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SUITE 800
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WASHINGTON, D.C. 20006-1021
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