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Patent Assignment Details

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Reel/Frame:	015501/0248			Pages:	3
		Recorded:	06/18/2004
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 1

Patent #:	7338909	Issue Dt:	03/04/2008	Application #:	10872238	Filing Dt:	06/18/2004
Publication #:	US20050282396	Pub Dt:	12/22/2005
Title:	MICRO-ETCHING METHOD TO REPLICATE ALIGNMENT MARKS FOR SEMICONDUCTOR WAFER PHOTOLITHOGRAPHY

Assignors

LIN, YU-LIANG

Exec Dt:

01/07/2004

CHANG, CHUNG-LONG

Exec Dt:

01/07/2004

LU, TONY

Exec Dt:

01/07/2004

LIN, CHUN-HSIEN

Exec Dt:

01/07/2004

WU, SUNNY

Exec Dt:

01/07/2004

HUANG, CHENG-LIN

Exec Dt:

01/07/2004

WANG, SHIH-CHE

Exec Dt:

01/07/2004

LO, HENRY

Exec Dt:

01/07/2004

HUANG, GEORGE

Exec Dt:

01/07/2004

YEH, GNESH

Exec Dt:

01/07/2004

ZHOU, MEI SHENG

Exec Dt:

01/07/2004

LIU, AI-SEN

Exec Dt:

01/07/2004

CHEN, LI-JUI

Exec Dt:

01/07/2004

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

NO. 8. LI-HSIN RD. 6

SCIENCE-BASED INDUSTRIAL PARK

HSIN-CHU, TAIWAN R.O.C.

Correspondence name and address
	TUNG & ASSOCIATES
	RANDY W. TUNG
	838 W. LONG LAKE ROAD
	SUITE 120
	BLOOMFIELD HILLS, MI 48302

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