Patent Assignment Details
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| Reel/Frame: | 015501/0802 | |
| Pages: | 4 |
| | Recorded: | 06/21/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/02/2008
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Application #:
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10789033
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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10/21/2004
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Title:
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ELECTRONIC COMPONENT AND SEMICONDUCTOR WAFER, AND METHOD FOR PRODUCING THE SAME
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Assignee
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| ST. MARTIN STR. 53 |
| MUNICH, GERMANY 81541 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA, PLLC
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PAUL P. KEMPF
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FIFTH STREET TOWERS, SUITE 2250
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100 SOUTH FIFTH STREET
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MINNEAPOLIS, MN 55402
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