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Patent Assignment Details
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Reel/Frame:015504/0103   Pages: 4
Recorded: 12/28/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/15/2009
Application #:
10950454
Filing Dt:
09/28/2004
Publication #:
Pub Dt:
05/12/2005
Title:
RESIN COMPOSITION FOR COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC MATERIAL AND ELECTRIC CIRCUIT BOARD USING THS SAME
Assignors
1
Exec Dt:
10/15/2004
2
Exec Dt:
10/15/2004
3
Exec Dt:
10/15/2004
4
Exec Dt:
10/15/2004
Assignee
1
1-1, KORAIBASHI 4-CHOME, CHUO-KU
OSAKA-SHI OSAKA, JAPAN 541-0043
Correspondence name and address
CONNOLLY BOVE LODGE & HUTZ LLP
BURTON A. AMERNICK
1990 M STREET, N.W., SUITE 800
ATTY. DKL. 21581-00333-US1
WASHINGTON, DC 20036-3425

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