Patent Assignment Details
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| Reel/Frame: | 015518/0208 | |
| Pages: | 3 |
| | Recorded: | 01/09/2004 | | |
| Attorney Dkt #: | A8319.0029/P029 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10483175
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Filing Dt:
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01/09/2004
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Publication #:
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Pub Dt:
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11/04/2004
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Title:
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WIRING GLASS SUBSTRATE FOR CONNECTING A SEMICONDUCTOR CHIP TO A PRINTED WIRING SUBSTRATE AND A SEMICONDUCTOR MODULE HAVING THE WIRING GLASS SUBSTRATE
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Assignee
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU, TOKYO 101-8010, JAPAN |
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Correspondence name and address
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DICKSTEIN SHAPIRO & OSHINSKY LLP
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MARK J. THRONSON
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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