Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015521/0737 | |
| Pages: | 3 |
| | Recorded: | 01/04/2005 | | |
| Attorney Dkt #: | uchiyama-1-a |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S AD |
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Total properties:
9
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Patent #:
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Issue Dt:
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11/01/1994
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Application #:
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07990000
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Filing Dt:
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12/11/1992
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Title:
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SEMICONDUCTOR DEVICE-ENCAPSULATING EPOXY RESIN COMPOSITION
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Patent #:
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Issue Dt:
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08/25/1998
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Application #:
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08696916
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Filing Dt:
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08/22/1996
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Title:
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EPOXY RESIN COMPOUND
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Patent #:
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Issue Dt:
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12/29/1998
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Application #:
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08793460
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Filing Dt:
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02/26/1997
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Title:
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EPOXY RESIN COMPOSITION
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Patent #:
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Issue Dt:
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07/06/1999
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Application #:
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08894751
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Filing Dt:
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08/26/1997
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Title:
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EPOXY RESIN COMPOSITION
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09008801
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Filing Dt:
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01/20/1998
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Title:
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EPOXY RESIN COMPOSITION TO SEAL SEMICONDUCTORS AND RESIN-SEALED SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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09095632
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Filing Dt:
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06/11/1998
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Title:
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EPOXY RESIN SEALANT CONTAINING A MIXTURE OF SILICA FILLERS
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Patent #:
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Issue Dt:
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03/26/2002
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Application #:
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09381765
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Filing Dt:
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09/23/1999
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Title:
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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING IT, AND SEMICONDUCTOR SEALING RESIN COMPOSITION
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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09804715
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Filing Dt:
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03/13/2001
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Publication #:
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Pub Dt:
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02/07/2002
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Title:
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EPOXY RESIN COMPOSITION TO SEAL SEMICONDUCTORS AND RESIN-SEALED SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09806733
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Filing Dt:
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04/04/2001
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Title:
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EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
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Assignee
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| 5-8, HIGASHISHINAGAWA 2-CHOME |
| SHINAGAWA-KU |
| TOKYO 140-0002, JAPAN |
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Correspondence name and address
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PIPER RUDNICK LLP
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T. DANIEL CHRISTENBURY
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ONE LIBERTY PLACE, SUITE 4900
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1650 MARKET STREET
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PHILADELPHIA, PA 19103
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