Patent Assignment Details
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| Reel/Frame: | 015526/0425 | |
| Pages: | 2 |
| | Recorded: | 06/28/2004 | | |
| Attorney Dkt #: | 63349.00007 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10876476
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Filing Dt:
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06/28/2004
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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Multi-layer circuit board and method for fabricating the same
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Assignee
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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SQUIRE SANDERS & DEMPSEY L.L.P.
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WILLIAM F. NIXON
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8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
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TYSONS CORNER, VIRGINIA 22182-2700
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