Patent Assignment Details
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| Reel/Frame: | 015535/0374 | |
| Pages: | 3 |
| | Recorded: | 07/06/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10485177
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Filing Dt:
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07/06/2004
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Publication #:
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Pub Dt:
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11/25/2004
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Title:
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SUBSTRATE PROCESSING APPARATUS AND METHOD
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Assignee
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| 11-1, HANDEA ASAHI-CHO, OHTA-KU |
| TOKYO 144-8510, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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MICHAEL S. HUPPERT, ESQ.
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2033 K STREET, N.W. SUITE 800
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WASHINGTON, DC 20006-1021
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