Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 015544/0186 | |
| Pages: | 2 |
| | Recorded: | 07/09/2004 | | |
| Attorney Dkt #: | 19036/38799 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10320333
|
Filing Dt:
|
12/16/2002
|
|
Publication #:
|
|
Pub Dt:
|
08/14/2003
| | | | |
|
Title:
|
Method and system of forming semiconductor wiring, method and system of fabrication semiconductor device, and wafer
|
|
|
Assignee
|
|
|
|
|
| 1-1, SHINMEIWA-CHO, TAKARAZUKA-SHI |
| HYOGO, JAPAN 665-8550 |
|
|
Correspondence name and address
|
| |
MARSHALL, GERSTEIN & BORUN LLP
|
| |
RICHARD H. ANDERSON
|
| |
233 S. WACKER DRIVE, SUITE 6300
|
| |
SEARS TOWER
|
| |
CHICAGO, IL 60606-6357
|
Search Results as of:
04/29/2024 05:45 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
