Patent Assignment Details
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| Reel/Frame: | 015566/0715 | |
| Pages: | 4 |
| | Recorded: | 07/09/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/25/2010
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Application #:
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10888224
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Filing Dt:
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07/09/2004
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Title:
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WAFER BONDED COMPOSITE STRUCTURE FOR THERMALLY MATCHING A READOUT CIRCUIT (ROIC) AND AN INFRARED DETECTOR CHIP BOTH DURING AND AFTER HYBRIDIZATION
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Assignee
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| 870 WINTER STREET |
| OFFICE OF THE GENERAL COUNSEL |
| WALTHAM, MASSACHUSETTS 02451-1449 |
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Correspondence name and address
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RAYTHEON COMPANY, WILLIAM C. SCHUBERT
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INTELLECTUAL PROPERTY & LICENSING
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2000 EAST EL SEGUNDO BOULEVARD
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P.O. BOX 902; EO/E04/N119
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EL SEGUNDO, CA 90245-0902
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