Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015568/0801 | |
| Pages: | 5 |
| | Recorded: | 07/08/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10887585
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Filing Dt:
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07/08/2004
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Publication #:
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Pub Dt:
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01/12/2006
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Title:
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BOND PAD STRUCTURE FOR COPPER METALLIZATION HAVING INCREASED RELIABILITY AND METHOD FOR FABRICATING SAME
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Assignee
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| ONE AMD PLACE, P.O. BOX 3453 |
| SUNNYVALE, CALIFORNIA 94088-3453 |
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Correspondence name and address
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FARJAMI & FARJAMI LLP
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MICHAEL FARJAMI, ESQ.
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24522 LA ALAMEDA AVE., SUITE 360
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MISSION VIEJO, CA 92691
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