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Patent Assignment Details
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Reel/Frame:015578/0094   Pages: 3
Recorded: 07/19/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/08/2008
Application #:
10797641
Filing Dt:
03/10/2004
Publication #:
Pub Dt:
11/18/2004
Title:
INSERT MOLDING DIE AND METHOD FOR MOLDING HOLLOW COMPONENT
Assignor
1
Exec Dt:
04/09/2004
Assignee
1
5-24-15, MINAMIDAI
NAKANO-KU, TOKYO, JAPAN 164-8602
Correspondence name and address
KILPATRICK STOCKTON LLP
BRENDA O. HOLMES
1100 PEACHTREE STREET
SUITE 2800
ATLANTA, GA 30309

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