Patent Assignment Details
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Reel/Frame: | 015595/0786 | |
| Pages: | 3 |
| | Recorded: | 07/22/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/22/2008
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Application #:
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10789423
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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SOLDER, MICROELECTROMECHANICAL COMPONENT AND DEVICE, AND A PROCESS FOR PRODUCING A COMPONENT OR DEVICE
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Assignees
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ST. MARTIN STR. 53 |
81541 MUNICH, GERMANY |
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LEONRODSTR. 54 |
80636 MUNICH, GERMANY |
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Correspondence name and address
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BEVER, HOFFMAN & HARMS, LLP
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PATRICK T. BEVER, ESQ.
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2099 GATEWAY PLACE, SUITE 320
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SAN JOSE, CA 95110
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