Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 015605/0349 | |
| Pages: | 6 |
| | Recorded: | 01/18/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10044777
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Filing Dt:
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01/11/2002
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Publication #:
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Pub Dt:
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07/17/2003
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Title:
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Semiconductor package device and method
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Patent #:
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Issue Dt:
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07/18/2006
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Application #:
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10610745
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Filing Dt:
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07/01/2003
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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CORROSION-RESISTANT COPPER BOND PAD AND INTEGRATED DEVICE
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Assignee
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6501 WILLIAM CANNON DRIVE WEST |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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ROBERT L. KING
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7700 WEST PARMER LANE
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PL02
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AUSTIN, TX 78729
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