Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015624/0234 | |
| Pages: | 2 |
| | Recorded: | 07/26/2004 | | |
| Attorney Dkt #: | 62807-207 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10898201
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Filing Dt:
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07/26/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Title:
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Electroless plating method, electroless plating device, and production method and production device of semiconductor device
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Assignee
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU TOKYO, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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KEITH E. GEORGE
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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