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Reel/Frame:015646/0153   Pages: 6
Recorded: 07/29/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/28/2007
Application #:
10903348
Filing Dt:
07/29/2004
Publication #:
Pub Dt:
02/02/2006
Title:
METHODS OF FORMING WIRE BONDS FOR SEMICONDUCTOR CONSTRUCTIONS
Assignors
1
Exec Dt:
06/28/2004
2
Exec Dt:
06/30/2004
3
Exec Dt:
07/19/2004
4
Exec Dt:
07/27/2004
Assignee
1
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83716
Correspondence name and address
WELLS ST. JOHN P.S.
DAVID G. LATWESEN
601 WEST FIRST AVE., STE. 1300
SPOKANE, WA 99201-3828

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