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Patent Assignment Details
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Reel/Frame:015651/0805   Pages: 3
Recorded: 08/03/2004
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/16/2010
Application #:
10909888
Filing Dt:
08/03/2004
Publication #:
Pub Dt:
02/10/2005
Title:
RESIST PATTERN THICKENING MATERIAL, PROCESS FOR FORMING RESIST PATTERN, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
07/21/2004
2
Exec Dt:
07/21/2004
Assignee
1
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588
Correspondence name and address
ARMSTRONG, KATZ, QUINTOS, HANSON &
BROOKS, LLP
SUITE 1000, 1725 K STREET
WASHINGTON, D.C. 20006

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