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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	015661/0092			Pages:	5
		Recorded:	08/09/2004
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 11

Patent #:	4918870	Issue Dt:	04/24/1990	Application #:	06864282	Filing Dt:	05/16/1986
Title:	FLOATING SUBCARRIERS FOR WAFER POLISHING APPARATUS

Patent #:	5205082	Issue Dt:	04/27/1993	Application #:	07811568	Filing Dt:	12/20/1991
Title:	WAFER POLISHER HEAD HAVING FLOATING RETAINER RING

Patent #:	5443416	Issue Dt:	08/22/1995	Application #:	08119972	Filing Dt:	09/09/1993
Title:	ROTARY UNION FOR COUUPLING FLUIDS IN A WAFER POLISHING APPARATUS

Patent #:	5527209	Issue Dt:	06/18/1996	Application #:	08449556	Filing Dt:	05/24/1995
Title:	WAFER POLISHER HEAD ADAPTED FOR EASY REMOVAL OF WAFERS

Patent #:	6231428	Issue Dt:	05/15/2001	Application #:	09261112	Filing Dt:	03/03/1999
Title:	CHEMICAL MECHANICAL POLISHING HEAD ASSEMBLY HAVING FLOATING WAFER CARRIER AND RETAINING RING

Patent #:	6309290	Issue Dt:	10/30/2001	Application #:	09294547	Filing Dt:	04/19/1999
Title:	CHEMICAL MECHANICAL POLISHING HEAD HAVING FLOATING WAFER RETAINING RING AND WAFER CARRIER WITH MULTI-ZONE POLISHING PRESSURE CONTROL

Patent #:	6068549	Issue Dt:	05/30/2000	Application #:	09363980	Filing Dt:	07/28/1999
Title:	STRUCTURE AND METHOD FOR THREE CHAMBER CMP POLISHING HEAD

Patent #:	6368189	Issue Dt:	04/09/2002	Application #:	09390142	Filing Dt:	09/03/1999
Title:	APPARATUS AND METHOD FOR CHEMICAL-MECHANICAL POLISHING (CMP) HEAD HAVING DIRECT PNEUMATIC WAFER POLISHING PRESSURE

Patent #:	6293845	Issue Dt:	09/25/2001	Application #:	09391073	Filing Dt:	09/04/1999
Title:	SYSTEM AND METHOD FOR END-POINT DETECTION IN A MULTI-HEAD CMP TOOL USING REAL-TIME MONITORING OF MOTOR CURRENT

Patent #:	NONE	Issue Dt:		Application #:	10021372	Filing Dt:	10/30/2001
Publication #:	US20020173242	Pub Dt:	11/21/2002
Title:	Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring

Patent #:	7029382	Issue Dt:	04/18/2006	Application #:	10027935	Filing Dt:	12/21/2001
Publication #:	US20020077045	Pub Dt:	06/20/2002
Title:	APPARATUS FOR CHEMICAL-MECHANICAL POLISHING (CMP) HEAD HAVING DIRECT PNEUMATIC WAFER POLISHING PRESSURE

Assignor

Exec Dt:

01/14/2004

Assignee

11-1, HANEDA ASAHI-CHO

OHTA-KU, TOKYO 144-8510, JAPAN

Correspondence name and address
	DORSEY & WHITNEY LLP
	R. MICHAEL ANANIAN, ESQ.
	SUITE 3400
	FOUR EMBARCADERO CENTER
	SAN FRANCISCO, CA 94111-4187

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