Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015662/0547 | |
| Pages: | 9 |
| | Recorded: | 08/09/2004 | | |
| Attorney Dkt #: | A-68359-1/RMA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/18/2006
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Application #:
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10027935
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Filing Dt:
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12/21/2001
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Publication #:
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Pub Dt:
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06/20/2002
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Title:
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APPARATUS FOR CHEMICAL-MECHANICAL POLISHING (CMP) HEAD HAVING DIRECT PNEUMATIC WAFER POLISHING PRESSURE
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Assignee
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| 1-5-1 OHTEMACHI, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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DORSEY & WHITNEY LLP
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R. MICHAEL ANANIAN, ESQ.
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SUITE 3400
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FOUR EMBARCADERO CENTER
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SAN FRANCISCO, CA 94111-4187
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