Patent Assignment Details
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| Reel/Frame: | 015666/0311 | |
| Pages: | 4 |
| | Recorded: | 04/21/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10493244
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Filing Dt:
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04/21/2004
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Publication #:
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Pub Dt:
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12/09/2004
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Title:
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Bonding wire
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Assignee
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| 1073, OAZA-EDA |
| SHIGARAKI-CHO KOUKA-GUN |
| SHIGA, JAPAN 529-1811 |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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600 13 STREET, NW
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WASHINGTON, D.C. 20005-3096
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05/10/2024 02:44 AM
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