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Patent Assignment Details
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Reel/Frame:015688/0165   Pages: 3
Recorded: 02/16/2005
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
03/07/1989
Application #:
07029819
Filing Dt:
03/25/1987
Title:
METHOD OF SECURING ELECTRONIC COMPONENTS TO A SUBSTRATE
2
Patent #:
Issue Dt:
08/15/1989
Application #:
07132009
Filing Dt:
12/11/1987
Title:
METHOD FOR FASTENING ELECTRONIC COMPONENTS TO A SUBSTRATE USING A FILM
3
Patent #:
Issue Dt:
04/05/1994
Application #:
08022878
Filing Dt:
02/25/1993
Title:
SEMICONDUCTOR COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
4
Patent #:
Issue Dt:
07/25/1995
Application #:
08327220
Filing Dt:
10/21/1994
Title:
SEMICONDUCTOR COMPONENT AND METHOD FOR THE MANUFACTURING THEREOF
Assignor
1
Exec Dt:
02/02/2005
Assignee
1
MAX-PLANCK-STRASSE 5
WARSTEIN, GERMANY 59581
Correspondence name and address
HEATHER ROWLAND
3000 CENTREGREEN WAY
CARY, NC 27513

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