Patent Assignment Details
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| Reel/Frame: | 015734/0061 | |
| Pages: | 5 |
| | Recorded: | 07/30/2004 | | |
| Attorney Dkt #: | YOR920030273US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10903365
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Filing Dt:
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07/30/2004
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Publication #:
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Pub Dt:
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02/02/2006
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Title:
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Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
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Correspondence name and address
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ALVIN J. RIDDLES
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BOX 34, CANDLEWOOD ISLE
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NEW FAIRFIELD, CT 06812
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