Patent Assignment Details
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| Reel/Frame: | 015743/0677 | |
| Pages: | 3 |
| | Recorded: | 08/27/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10927931
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Filing Dt:
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08/27/2004
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Publication #:
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Pub Dt:
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03/02/2006
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Title:
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Multilayer circuit board and method of producing the same
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Assignee
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| 31-16, HORIFUNE 1-CHOME, KITA-KU |
| TOKYO, JAPAN 114-0004 |
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Correspondence name and address
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QUARLES & BRADY LLP
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DANIEL G. RADLER
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411 EAST WISCONSIN AVENUE
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MILWAUKEE, WI 53202
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