Patent Assignment Details
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| Reel/Frame: | 015752/0090 | |
| Pages: | 3 |
| | Recorded: | 09/01/2004 | | |
| Attorney Dkt #: | 16869S114500US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/11/2009
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Application #:
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10836098
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Filing Dt:
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04/29/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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SEMICONDUCTOR MODULE IN WHICH A SEMICONDUCTOR PACKAGE IS BONDED ON A MOUNT SUBSTRATE
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Assignees
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| 6, KANDA SURUGADAI 4-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| 2-1, YAEUA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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Correspondence name and address
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TOWNSEND AND TOWNSEND AND CREW LLP
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ROBERT C. COLWELL
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2 EMBARCADERO CENTER
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8TH FLOOR
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SAN FRANCISCO, CA 94111-3834
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