Patent Assignment Details
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| Reel/Frame: | 015753/0058 | |
| Pages: | 3 |
| | Recorded: | 08/31/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2007
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Application #:
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10929471
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Filing Dt:
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08/31/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Title:
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METHOD OF PRODUCING ULTRA-THIN COPPER FOIL WITH CARRIER, ULTRA-THIN COPPER FOIL WITH CARRIER PRODUCED BY THE SAME, PRINTED CIRCUIT BOARD, MULTILAYER PRINTED CIRCUIT BOARD AND CHIP ON FILM CIRCUIT BOARD
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Assignee
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| 8-9, KANDANISHIKI-CHO, 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0054 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH ET AL.
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JAMES M. SLATTERY
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8110 GATEHOUSE RD
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SUITE 100 EAST
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FALLS CHURCH, VA 22040-0747
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