Patent Assignment Details
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Reel/Frame: | 015754/0524 | |
| Pages: | 3 |
| | Recorded: | 09/02/2004 | | |
Attorney Dkt #: | 04329.3311 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2006
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Application #:
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10838261
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Filing Dt:
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05/05/2004
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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SLURRY FOR CMP, POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Assignee
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1-1 SHIBAURA 1-CHOME, MINATO-KU |
TOKYO 105-8001, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW ET AL.
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ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005-3315
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