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Patent Assignment Details
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Reel/Frame:015806/0064   Pages: 3
Recorded: 09/21/2004
Conveyance: CORRECTION TO THE SERIAL NUMBER
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10803958
Filing Dt:
03/19/2004
Publication #:
Pub Dt:
10/07/2004
Title:
Method for manufacturing semiconductor device
Assignor
1
Exec Dt:
03/10/2004
Assignee
1
16-1 ONOGAWA
TSUKUBA-SHI
IBARAKI, JAPAN 305-0053
Correspondence name and address
LEYDIG, VOIT & MAYER
JEFFREY A. WYAND
700 THIRTEENTH ST., N.W., SUITE 300
WASHINGTON, D.C. 20005-3960

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