Patent Assignment Details
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| Reel/Frame: | 015806/0744 | |
| Pages: | 3 |
| | Recorded: | 09/14/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10941586
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Filing Dt:
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09/14/2004
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Publication #:
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Pub Dt:
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03/16/2006
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Title:
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Packaging with metal studs formed on solder pads
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Assignee
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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Correspondence name and address
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DUANE MORRIS LLP
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WILLIAM H. MURRAY, ESQ.
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ONE LIBERTY PLACE
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PHILADELPHIA, PA 19103
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