Patent Assignment Details
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| Reel/Frame: | 015807/0466 | |
| Pages: | 2 |
| | Recorded: | 09/17/2004 | | |
| Attorney Dkt #: | chun3086/em |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10942774
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Filing Dt:
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09/17/2004
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Publication #:
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Pub Dt:
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03/17/2005
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Title:
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Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof
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Assignee
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| 26 CHIN 3RD RD. |
| NANTZE EXPORT PROCESSING ZONE |
| KAOSHIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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BACON & THOMAS, PLLC
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EUGENE MAR
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625 SLATERS LANE
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FOURTH FLOOR
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ALEXANDRIA, VA 22314
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