Patent Assignment Details
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| Reel/Frame: | 015814/0639 | |
| Pages: | 4 |
| | Recorded: | 05/24/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10496379
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Filing Dt:
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05/24/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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BONDED WAFER AND METHOD OF PRODUCING BONDED WAFER
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Assignee
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| 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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Correspondence name and address
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OLIFF & BERRIDGE, PLC
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WILLIAM P. BERRIDGE
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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