Patent Assignment Details
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| Reel/Frame: | 015862/0866 | |
| Pages: | 2 |
| | Recorded: | 10/06/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2007
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Application #:
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10896993
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Filing Dt:
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07/23/2004
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Publication #:
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Pub Dt:
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01/27/2005
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Title:
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SEMICONDUCTOR COMPONENT OF SEMICONDUCTOR CHIP SIZE WITH FLIP-CHIP-LIKE EXTERNAL CONTACTS, AND METHOD OF PRODUCING THE SAME
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Assignee
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| ST.-MARTIN-STR. 53 |
| 81669 MUNICH, GERMANY |
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Correspondence name and address
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EDELL, SHAPIRO & FINNAN, LLC
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HEATHER MORIN
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1901 RESEARCH BLVD., SUITE 400
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ROCKVILLE, MD 20850
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