Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 015865/0332 | |
| Pages: | 3 |
| | Recorded: | 09/27/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10860115
|
Filing Dt:
|
06/04/2004
|
|
Publication #:
|
|
Pub Dt:
|
02/03/2005
| | | | |
|
Title:
|
Plating apparatus, plating method and substrate processing apparatus
|
|
|
Assignee
|
|
|
|
|
| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
|
|
Correspondence name and address
|
| |
WENDEROTH, LIND & PONACK, L.L.P.
|
| |
MICHAEL S. HUPPERT, ESQ.
|
| |
2033 K STREET, N.W., SUITE 800
|
| |
WASHINGTON, D.C. 20006-1021
|
Search Results as of:
04/19/2024 03:23 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
