Patent Assignment Details
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| Reel/Frame: | 015884/0116 | |
| Pages: | 3 |
| | Recorded: | 10/07/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10959098
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Filing Dt:
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10/07/2004
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Publication #:
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Pub Dt:
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03/03/2005
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Title:
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Solder-fill application for mounting semiconductor chip on PCB
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Assignee
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| SAN 56-1, SHINLIM DONG, KWANAK GU |
| RM #302-427 MECHANICAL & AEROSPACE ENGINEERING |
| SEOUL, KOREA, REPUBLIC OF 151-741 |
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Correspondence name and address
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G W I P S
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PETER T. KWON
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KANGNAM P.O. BOX 2301
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SEOUL 135-242, REPUBLIC OF KOREA
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