Patent Assignment Details
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| Reel/Frame: | 015971/0460 | |
| Pages: | 3 |
| | Recorded: | 11/08/2004 | | |
| Attorney Dkt #: | 669=77 CON/CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10736486
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Filing Dt:
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12/15/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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High density integrated circuits and the method of packaging the same
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Assignee
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| 151 AMBER STREET |
| UNT 1 |
| MARKHAM, ONTARIO, CANADA L3R 3B3 |
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Correspondence name and address
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DANIEL A. SCOLA
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HOFFMANN & BARON
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6900 JERICHO TURNPIKE
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SYOSSET, NY 07054
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05/14/2024 10:41 AM
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