Patent Assignment Details
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| Reel/Frame: | 015999/0451 | |
| Pages: | 3 |
| | Recorded: | 11/12/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/22/2007
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Application #:
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10988042
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Filing Dt:
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11/12/2004
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Publication #:
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Pub Dt:
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06/16/2005
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Title:
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METHOD FOR ETCHING OF A SILICON SUBSTRATE AND ETCHING APPARATUS
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Assignee
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| 1-10, FUSO-CHO |
| AMAGASAKI-SHI, HYOGO, 660-0891, JAPAN |
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Correspondence name and address
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JOSEPH R. ROBINSON
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DARBY & DARBY P.C.
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ATTY. DKT.: 20110/0201859-US0
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P.O. BOX 5257
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NEW YORK, NY 10150-5257
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