Patent Assignment Details
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Reel/Frame: | 016003/0842 | |
| Pages: | 3 |
| | Recorded: | 11/15/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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10986783
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Filing Dt:
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11/15/2004
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Publication #:
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Pub Dt:
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05/19/2005
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFER
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Assignee
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14-3, HIGASHI KOJIYA 2-CHOME, OTA-KU, |
TOKYO, JAPAN 144-0033 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: CHARLES R. WATTS, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, DC 20006-1021
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