Patent Assignment Details
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Reel/Frame: | 016037/0157 | |
| Pages: | 5 |
| | Recorded: | 04/08/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/13/2005
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Application #:
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09395179
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Filing Dt:
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09/14/1999
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Title:
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PACKAGE FOR ELECTRONIC COMPONENT, LID MATERIAL FOR PACKAGE LID, AND PRODUCTION METHOD FOR LID MATERIAL
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Assignee
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19-1, MINAMISUITA 2-CHOME |
SUITA-SHI, OSAKA, JAPAN 564-0043 |
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Correspondence name and address
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JOSEPH R. KEATING
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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