Patent Assignment Details
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| Reel/Frame: | 016151/0182 | |
| Pages: | 3 |
| | Recorded: | 12/30/2004 | | |
| Attorney Dkt #: | CU-4041 RJS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2007
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Application #:
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11026971
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Filing Dt:
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12/30/2004
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Publication #:
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Pub Dt:
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07/07/2005
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Title:
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MULTILAYER INTERCONNECTION BOARD AND PRODUCTION METHOD THEREOF
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Assignee
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| 80, OSHIMADAMACHI, NAGANO-SHI |
| NAGANO 381-2287, JAPAN |
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Correspondence name and address
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BRIAN W. HAMEDER
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C/O LADAS & PARRY LLP
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224 SOUTH MICHIGAN AVENUE
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CHICAGO, IL 60604
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