Patent Assignment Details
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| Reel/Frame: | 016193/0969 | |
| Pages: | 7 |
| | Recorded: | 01/25/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/27/2007
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Application #:
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10974789
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Filing Dt:
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10/28/2004
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Publication #:
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Pub Dt:
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05/26/2005
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Title:
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THIN FILM CAPACITOR, HIGH-DENSITY PACKAGING SUBSTRATE INCORPORATING THIN FILM CAPACITOR, AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR
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Assignees
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| 104, TOTSUKA-MACHI 1-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 169-8050 |
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| 7-12, TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8460 |
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| 150 NAKAMARUKO, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN 211-0012 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: MATTHEW M. JACOB, ESQ.
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2033 K STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20006-1021
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