Patent Assignment Details
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| Reel/Frame: | 016225/0381 | |
| Pages: | 4 |
| | Recorded: | 01/25/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11043748
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Filing Dt:
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01/25/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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Method and apparatus for wafer to wafer bonding
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Assignees
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| 6-CHOME, SHINAGAWA-KU |
| 7-35 KITASHINAGAWA |
| TOKYO, JAPAN |
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| 1 SONY DRIVE |
| PARK RIDGE, NEW JERSEY 07656 |
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Correspondence name and address
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CHARLES J. KULAS
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CARPENTER & KULAS, LLP
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1900 EMBARCADERO ROAD
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SUITE 109
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PALO ALTO, CA 94303
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