Patent Assignment Details
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| Reel/Frame: | 016230/0438 | |
| Pages: | 3 |
| | Recorded: | 02/03/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11003227
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Filing Dt:
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12/03/2004
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Publication #:
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Pub Dt:
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06/08/2006
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Title:
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Dielectric etch method with high source and low bombardment plasma providing high etch rates
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Assignee
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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APPLIED MATERIALS
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PATENT COUNSEL
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P.O. BOX 450-A
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SANTA CLARA, CALIFORNIA 95035
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