Patent Assignment Details
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| Reel/Frame: | 016280/0874 | |
| Pages: | 2 |
| | Recorded: | 02/11/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11055116
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Filing Dt:
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02/11/2005
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Publication #:
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Pub Dt:
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06/15/2006
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Title:
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Semiconductor package structure and method for fabricating the same
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Assignee
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK, TAIWAN R.O.C. |
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Correspondence name and address
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SQUIRE SANDERS & DEMPSEY L.L.P.
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8000 TOWERS CRESCENT DRIVE, 14TH FLOOR
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TYSONS CORNER, VA 22182-2700
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