Patent Assignment Details
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| Reel/Frame: | 016313/0696 | |
| Pages: | 5 |
| | Recorded: | 04/15/2005 | | |
| Attorney Dkt #: | 4296-181 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11038299
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Filing Dt:
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01/19/2005
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Publication #:
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Pub Dt:
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08/11/2005
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Title:
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Wafer-level package and method for production thereof
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Assignee
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| 7-21-11, NISHI-GOTANDA, SHINAGAWA-KU |
| TOKYO 141-0031, JAPAN |
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Correspondence name and address
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DIANE DUNN MCKAY, ESQ.
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MATHEWS, COLLINS, SHEPHERD ET AL.
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100 THANET CIRCLE, SUITE 306
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PRINCETON, NJ 08540
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