Patent Assignment Details
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| Reel/Frame: | 016324/0847 | |
| Pages: | 3 |
| | Recorded: | 02/23/2005 | | |
| Attorney Dkt #: | H6808.0078/P078 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/13/2008
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Application #:
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11062867
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Filing Dt:
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02/23/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND THE PRODUCTION METHOD
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Assignees
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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MARK J. THRONSON
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DICKSTEIN SHAPIRO MORIN & OSHINSKY LLP
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2101 L STREET NW
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WASHINGTON, DC 20037-1526
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