Patent Assignment Details
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| Reel/Frame: | 016337/0010 | |
| Pages: | 3 |
| | Recorded: | 02/25/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11067117
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Filing Dt:
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02/25/2005
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Publication #:
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Pub Dt:
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08/31/2006
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Title:
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Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same method
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Assignee
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| 2-1, SHIBAURA 1-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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Correspondence name and address
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JULES E. GOLDBERG, ESQ.
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REED SMITH LLP
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599 LEXINGTON AVENUE, 29TH FL
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NEW YORK, NY 10022
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