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Reel/Frame:016343/0980   Pages: 3
Recorded: 08/05/2004
Attorney Dkt #:51023-021
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/11/2007
Application #:
10503496
Filing Dt:
08/05/2004
Publication #:
Pub Dt:
06/02/2005
Title:
FINE ELECTROFORMING MOLD AND MANUFACTURING METHOD THEREOF
Assignors
1
Exec Dt:
12/04/2003
2
Exec Dt:
12/04/2003
3
Exec Dt:
12/04/2003
Assignee
1
5-33, KITAHAMA 4-CHOME CHUO-KU
OSAKA-SHI, OSAKA, JAPAN 541-0041
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
600 13TH STREET, N.W.
WASHINGTON, D.C. 20005-3096

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