Patent Assignment Details
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| Reel/Frame: | 016364/0776 | |
| Pages: | 4 |
| | Recorded: | 03/04/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10431275
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Filing Dt:
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05/07/2003
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Publication #:
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Pub Dt:
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02/05/2004
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Title:
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NOVEL MATERIAL TO IMPROVE IMAGE SENSOR YIELD DURING WAFER SAWING
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Assignee
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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Correspondence name and address
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WON JOON KOUH
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DUANE MORRIS LLP
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P.O. BOX 5203
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PRINCETON, NJ 08543-5203
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