Patent Assignment Details
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| Reel/Frame: | 016370/0693 | |
| Pages: | 3 |
| | Recorded: | 03/16/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/22/2011
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Application #:
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11043123
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Filing Dt:
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01/27/2005
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Publication #:
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Pub Dt:
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08/04/2005
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Title:
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MODULE WITH A BUILT-IN COMPONENT, AND ELECTRONIC DEVICE WITH THE SAME
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA 571-8501, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK, L.L.P.
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ATTN: MICHAEL S. HUPPERT, ESQ.
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2033 K STREET, N.W., SUITE 800
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WASHINGTON, D.C. 20006-1021
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