Patent Assignment Details
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| Reel/Frame: | 016389/0116 | |
| Pages: | 3 |
| | Recorded: | 03/14/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/28/2006
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Application #:
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11079995
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Filing Dt:
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03/14/2005
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Publication #:
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Pub Dt:
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09/14/2006
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Title:
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METHOD OF PROCESSING SEMICONDUCTOR WAFER
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Assignee
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| NO. 3, PASIR RIS DRIVE 12, SINGAPORE |
| 519528, SINGAPORE |
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Correspondence name and address
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J.C. PATENTS, INC.
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4 VENTURE, SUIE 250
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IRVINE, CA 92618
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